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Quite some time ago, we wrote up some specs on a [[PC Build]]. Fast-forward to 2024 and it's time to build a new Linux Workstation and here's some details on that.
==Processor(CPU)==
Intel Core i9-14900K 3.2 GHz 24-Core Processor
|Yes
|}
 
== CPU Cooler ==
Cooler Master Hyper 212 Black CPU Air Cooler, SickleFlow 120 Edge Fan, Aluminum Top Cover, 4 Copper Heat Pipes, CryoFuze, 152mmTall,Brackets AMD Ryzen AM5/AM4, Intel LGA1700/1200 (RR-S4KK-25SN-R1)
 
* Direct contact technology: 4 Heat Pipe with exclusive direct contact Technology effectively provides excellent heat dissipation; Air flow: 42 CFM; Noise level: 26.0 decibels
* Precise air flow: Stacked fin array ensures least airflow resistance which allows cooler air flow into the heatsink
* Smart fan sensor for jam protection: Never worry about your cables getting snagged or components being mucked up ever again
* Snap and play: Intuitive fan bracket design makes upgrading and removing the fan a breeze
* CPU socket support: Intel: LGA2066, LGA2011 v3, LGA2011, LGA1151, LGA1150, LGA1156, LGA1155, LGA1366, AMD: AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1
==Motherboard==
*High Quality PCB: 6-layer PCB made by 2oz thickened copper and server grade level material
<br {| class="wikitable"!Processor|‎pentium|-!RAM|‎DDR5|-!Memory Speed|‎7800 MHz|-!Wireless Type|‎Bluetooth|-!Number of USB 2.0 Ports|‎6|}{| class="wikitable"!Brand|‎MSI|-!Item model number|‎PRO Z790-A MAX WiFi|-!Item Weight|‎4 pounds|-!Product Dimensions|‎12 x 9.9 x 1.75 inches|-!Item Dimensions LxWxH|‎12 x 9.9 x 1.75 inches|-!Manufacturer|‎MSI|-!ASIN|‎B0CJSJ9TB3|-!Country of Origin|‎China|-!Date First Available|‎September 25, 2023|} == Storage ==Crucial P3 Plus 4TB PCIe Gen4 3D NAND NVMe M.2 SSD, up to 5000MB/>s - CT4000P3PSSD8 * NVMe (PCIe Gen4 x4) technology with up to 5000MB/s sequential reads, random read/write 650K/900K IOPS * Spacious storage up to 4TB * Performs up to 43% faster than the fastest Gen3 NVMe SSDs * Rated at MTTF greater than 1.5 million hours for extended longevity and reliability * Backward compatibility with Gen3
== Memory (RAM ) ==G.SKILL Flare X Series 64GB (2 x 32GB) 288-Pin PC RAM DDR5 6000 (PC5 48000) Desktop Memory Model F5-6000J3040G32GX2-FX5
* DDR5 6000 (PC5 48000)* Timing 30-40-40-96* CAS Latency 30* Voltage 1.40V
{| class="wikitable"
|288-Pin PC RAM
|-
!<abbr title="Memory speed is commonly expressed in effective frequency, which means data transfer cycles performed each second. For example, DDR3 1600 refers to a 1600 million transfer per second. Each RAM transfer cycle consists of a 64-bit word, or eight bytes. By multiplying the frequency by eight, you convert transfers-per-second into bytes-per-second, namely the theoretical bandwidth. For DDR3 1600, its bandwidth is 12.8 gigabytes per second. Memory is designed to be backward-compatible, so generally speaking, you can safely add faster memory to a computer that was designed to run slower memory. However, your system will operate at the speed of the slowest memory module. One thing to keep in mind is that the memory does need to be the same type.">Speed</abbr>
|DDR5 6000 (PC5 48000)
|-
!<abbr title="Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CL, the better.">CAS</abbr> Latency
|30
|-
!<abbr title="Memory timings or RAM timings measure the performance of DRAM memory using four parameters: CL, tRCD, tRP, and tRAS in units of clock cycles; they are commonly written as four numbers separated with dashes, e.g. 7-8-8-24. The fourth (tRAS) is often omitted, and a fifth, the Command rate, sometimes added (normally 2T or 1T ?also 2N, 1N). These parameters specify the latencies (time delays) that affect the speed of the random access memory. Lower numbers usually imply faster performance. What determines absolute system performance is the actual latency time, usually measured in nanoseconds. For example CL=7 for memory bus with clock 1ns (frequency 1000MHz), gives an absolute latency of 7ns. Other memory with CL=8 and memory bus 0.75ns (750ps, frequency 1333MHz), gives an absolute latency of 6ns.">Timing</abbr>
|30-40-40-96
|-
!<abbr title="DDR3 memories operate at lower voltages compared to DDR2 memories, which in turn operate at lower voltages compared to DDR memories. This means that DDR3 memories consume less power than DDR2 memories, which in turn consume less power than DDR memories. Typically, DDR memories are fed with 2.5 V, DDR2 memories are fed with 1.8 V, and DDR3 memories are fed with 1.5 V. DDR3L, the low Voltage DDR3, supports 1.35V and 1.5V operation. When configured at 1.35V, DDR3L memory can reduce server power consumption by 15% or more over an equivalent 1.5V memory, especially on servers. Some memory modules may require higher voltages than those listed. This happens especially with memories supporting the operation of clock rates higher than the official ones (i.e., memories targeted to overclocking).">Voltage</abbr>
|1.40V
|-
!<abbr title="The AMD Extended Profiles for Overclocking (AMD EXPO Technology) was developed to allow for user-friendly memory overclocking support of all types of memory, giving users an easy path to accelerated power to achieve accelerated memory in their system.
Intel Extreme Memory Profile (Intel XMP) lets you overclock compatible DDR4 /DDR5 memory modules to enhance the gaming features built into PCs with Intel Core processors.">BIOS/Performance Profile</abbr>
|AMD EXPO
|-
!LED Color
|None
|}
 
== Video Card (GPU) ==
GIGABYTE GeForce RTX 4060 WINDFORCE OC 8G Graphics Card, 2X WINDFORCE Fans, 8GB 128-bit GDDR6, GV-N4060WF2OC-8GD Video Card
 
* Powered by NVIDIA DLSS 3, ultra-efficient Ada Lovelace architechture, and full ray tracing
* 4th Generation Tensor Cores: Up to 4x performance with DLSS 3
* 3rd Generation RT Cores: Up to 2x ray tracing performance
* Powered by GeForce RTX 4060
* Integrated with 8GB GDDR6 128-bit memory interface
* WINDFORCE Cooling System, RGB Fusion, Dual BIOS, Protection metal back plate
 
<br />
 
== Power Supply ==
CORSAIR RM1000x Fully Modular ATX Power Supply - 80 PLUS Gold - Low-Noise Fan - Zero RPM - Black
 
* Fully Modular: Only connect the cables your system needs, making clean and tidy builds easier.
* 135mm Magnetic Levitation Fan: Utilizes a magnetic levitation bearing and custom engineered rotors for high performance, low noise, and superior reliability.
* EPS12V Connector: For wide compatibility with modern graphics cards and motherboards.
* 100% All Japanese 105°C Capacitors: Premium internal components ensure unwavering power delivery and long-term reliability.
* Modern Standby Compatible: Extremely fast wake-from-sleep times and better low-load efficiency.
* 80 PLUS Gold Certified: High efficiency operation for lower power consumption, less noise, and cooler temperatures.
 
== Case ==
Zalman i3 NEO ATX Mid Tower Gaming PC Case - 4 x 120mm Fixed RGB Fans Preinstalled - Mesh Front Panel for High Airflow - Tempered Glass Side Panel, Black
 
* Hinged Glass Side Panel: Experience effortless style and functionality with the Hinged Glass Side Panel. Its beautiful, full edge-to-edge tempered glass design swings open for quick access to your interior components, making installation and cleaning a breeze.
* Full Tempered Glass Front Panel: Upgrade your build and showcase your epic fans with our Tempered Glass Front Panel. With excellent durability and noise reduction, experience style and functionality in one.
* 4x Pre-Installed Static LED Fans: Add some flair to your build with 4 pre-installed static rainbow LED fans, from front to rear. Whether you're gaming, working, or just using your PC, the lightshow created by these fans will leave a lasting impression.
* Magnetic Dust Filter: Keep your build running smoothly with the Magnetic Dust Filter. The top filter is magnetic for easy removal and cleaning, and the bottom detachable filter ensures your system stays dust-free. The metal feet with rubberized cushions absorb vibrations for silent operations.
* Spacious Interior: With space for up to 360mm radiator in the front, up to 240mm radiator on top, and 120mm in the rear, you'll have plenty of room for all your components. The top ports include headphone jack, microphone port, 2x USB 3.0, USB 2.0, reset, and power buttons, making it easier than ever to connect your peripherals.
 
<br />
{| class="wikitable"
!Number of USB 2.0 Ports
|‎1
|-
!Number of USB 3.0 Ports
|‎2
|}
{| class="wikitable"
!Brand
|‎Zalman
|-
!Series
|‎i3 Neo BK
|-
!Item Weight
|‎12.5 pounds
|-
!Product Dimensions
|‎16.61 x 8.62 x 19.06 inches
|-
!Item Dimensions LxWxH
|‎16.61 x 8.62 x 19.06 inches
|-
!Color
|‎Black
|-
!Manufacturer
|‎Zalman Tech Co., Ltd
|-
!ASIN
|‎B0BGJTR3BR
|-
!Country of Origin
|‎China
|-
!Date First Available
|‎September 26, 2022
|}